RESIN COMPOSITION CONTAINING POLYIMIDE PRECURSOR, METHOD FOR MANUFACTURING CURED FILM, AND ELECTRONIC COMPONENT

摘要

A resin composition containing (a) a polyimide precursor having a structural unit expressed in formula (1) shown below, and (b) a photopolymerizing compound having an ethylenically unsaturated group and an isocyanuric ring structure. In formula (1), R1 is a tetravalent organic group, and R2 is a divalent organic group. R3 and R4 are each independently hydrogen atoms, C1-20 alkyl groups, C3-20 cycloalkyl groups, or monovalent organic groups having an unsaturated carbon-carbon double bond.