发明名称 |
NON-AMINE POST-CMP COMPOSITIONS AND METHOD OF USE |
摘要 |
An amine-free composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The compositions achieve highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material, copper interconnect material, or cobalt-containing materials. |
申请公布号 |
WO2015119925(A1) |
申请公布日期 |
2015.08.13 |
申请号 |
WO2015US14203 |
申请日期 |
2015.02.03 |
申请人 |
ADVANCED TECHNOLOGY MATERIALS, INC. |
发明人 |
LIU, JUN;THOMAS, ELIZABETH;FRYE, DONALD |
分类号 |
C11D7/60;H01L21/304 |
主分类号 |
C11D7/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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