Cu BALL, Cu CORE BALL, SOLDER JOINT, SOLDER PASTE, AND SOLDER FOAM

摘要

Provided are: a Cu ball having strong falling-impact resistance and capable of suppressing the occurrence of joining failures and the like; a Cu core ball; a solder joint; a solder paste; and a solder foam. An electronic component (60) is configured in a manner such that a solder bump (30) of a semiconductor chip (10) and an electrode (41) of a printed circuit board (40) are joined by a solder paste (12, 42). The solder bump (30) is formed by joining a Cu ball (20) to an electrode (11) of the semiconductor chip (10). This Cu ball (20) exhibits a purity of 99.9-99.995%, inclusive, a sphericity of 0.95 or higher, and a Vickers hardness of 20-60HV, inclusive.