| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an EFEM system capable of transporting wafers without exposing them to atmosphere which causes a change in surface properties and adhesion of particles.SOLUTION: An EFEM comprises: a housing in which a load port is connected to a front wall 31 that is a wall surface, and a wafer transfer apparatus 9 which is closed by connecting a processor to a back surface wall 32, is formed; a wafer transport apparatus 9 for transporting the wafer between a FOUP and the processor; a gas outlet 11 for introducing into the wafer transport apparatus 9; a gas suction port 12 for sucking the gas from the wafer transport apparatus 9; a gas feedback channel 10 for returning the gas sucked from the gas suction port 12 to the gas outlet 11; and a FEU 13 provided on the gas outlet 11 and having a filter removing particles included in the introduced gas. A generation of down draft in the wafer transport apparatus 9 and returning of the gas through the gas feedback channel 10, cycles nitrogen gas in the wafer transport apparatus 9.</p> |
