| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a conductive adhesive having a long pot life and a low electric resistance after curing.SOLUTION: A conductive adhesive comprises (A) Ag Sn alloy powder in which the thickness of a surface oxide film measured in depth direction analysis of X-ray photoelectron spectroscopy is 20 nm or more and 40 nm or less, (B) 8-quinolinol, and (C) thermosetting resin. Preferably, the surface oxide film of the (A) component comprises Ag, Sn and O, and more preferably, at least part of the (A) component is scaly.</p> |
