发明名称 Conductive Grid Sensor for Smart Packaging
摘要 A blister packaging including a blister card including a plurality of flexible blisters; and a backing sheet including blister backing portions and backing securing portions, wherein when the backing securing portions are secured to the blister card, the blister backing portions are aligned to each blister forming a plurality of compartments adapted to store a medicament, and wherein the backing includes two or more conductive first leads affixed to the backing, two or more conductive second leads affixed to the backing, and a plurality of conductive zones, wherein each conductive zone electrically connects one of the first leads to one of the second leads, and wherein each blister backing portion includes a conductive zone.
申请公布号 US2015228178(A1) 申请公布日期 2015.08.13
申请号 US201514620792 申请日期 2015.02.12
申请人 Vatex Explorations, LLC 发明人 Harris James Wayne
分类号 G08B21/18;A61J7/00;A61J7/02;A61J1/03 主分类号 G08B21/18
代理机构 代理人
主权项 1. A remote unit-dose monitoring system comprising: a blister card including a plurality of flexible blisters; and a backing sheet including blister backing portions and backing securing portions, wherein when the backing securing portions are secured to the blister card, the blister backing portions are aligned to each blister, forming a plurality of compartments adapted to store a medicament, and wherein the backing sheet includes; two or more conductive first leads affixed to the backing sheet, two or more conductive second leads affixed to the backing sheet, and a plurality of conductive zones, wherein each conductive zone electrically connects one of the first leads to one of the second leads, and wherein each blister backing portion includes a conductive zone.
地址 Grapevine TX US