发明名称 ADHESIVE RESIN COMPOSITION, ADHESIVE TAPE, ADHESIVE TAPE WITH SUBSTRATE, AND COMPOSITE ARTICLE
摘要 Provided is an adhesive resin composition having good acclimation to fiber-reinforced thermoplastic and that can be used as an adhesive capable of demonstrating sufficient adhesive strength to another adherend. Also provided is an adhesive tape formed by curing such an adhesive resin composition. Furthermore provided is an adhesive tape with substrate having a substrate layer and a layer formed by curing such an adhesive resin composition. Furthermore provided is a composite article comprising any of the adhesive resin composition, adhesive tape, and adhesive tape with substrate of the present invention, and a fiber-reinforced thermoplastic (FRTP). The adhesive resin composition of the present invention comprises a polyamide resin and an epoxy resin, wherein the content of the polyamide resin is 15 parts by weight or more and less than 100 parts by weight with respect to 100 parts by weight of the epoxy resin. Also, the adhesive resin composition of the present invention comprises a polyamide resin and an epoxy resin, wherein the shearing adhesive force of the adhesive tape, which is formed by curing the adhesive resin composition, to the fiber-reinforced thermoplastic is 2.5 Mpa to 70.0 MPa at 25°C and 2.2 MPa to 70.0 MPa at 80°C.
申请公布号 WO2015119229(A1) 申请公布日期 2015.08.13
申请号 WO2015JP53323 申请日期 2015.02.06
申请人 NITTO DENKO CORPORATION 发明人 FUJII, TAKAHIRO;KOSO, MASATSUGU
分类号 C09J163/00;B32B5/28;C09J7/02;C09J163/02;C09J177/00 主分类号 C09J163/00
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