INTEGRATED CIRCUIT DEVICE HAVING SUPPORTS FOR USE IN A MULTI-DIMENSIONAL DIE STACK

摘要

Provided is an integrated circuit (IC) device having a support structure for use in a multi-dimensional (e.g., 3-D) die stack. The IC device includes a first chip (e.g., a memory die) positioned over a second chip (e.g., a logic layer), and a set of support structures between the memory die and the logic layer, wherein the set of support structures is arranged so as to radiate from a center of the memory die. In one approach, the set of support structures comprises two linear arrays each including a plurality of support members coupled to the memory die, the two linear arrays arranged in a standardized diagonal crossing configuration to provide increased stability between the memory die and the logic layer. In an exemplary embodiment, the set of support structures is connected to a power grid to help deliver power to circuitry of the memory die.

主权项

1. An integrated circuit (IC) device, comprising:
a set of support structures between at least a first and second chip of the IC device, the first chip comprising a memory die, and the set of support structures radiating uniformly from a center of the memory die, and a power grid formed on and extending over a substantial portion of the memory die, a first portion of the power grid being adapted for being coupled to a first voltage source, and a first plurality of the support structures are coupled to the first portion of the power grid at spaced apart locations to receive the first voltage source.