MOULDING METHOD FOR PRODUCING AN ELECTRONIC HOUSING

摘要

The invention concerns a method for producing a smart card or telecommunication module electronic housing, comprising an electronic chip in the housing, a face comprising at least one set of conductive metal platings, said method comprising the following steps: providing or producing at least one set of metal platings comprising conductive circuit pads or tracks, on one side of a substrate, transferring and connecting a chip to each set of platings, overmoulding each chip with the set of metal platings of same on the substrate with a moulding material in order to produce at least one housing, separating the housing from the substrate thereof, wherein the side of the substrate in contact with the metal platings comprises an adhesive or has low adhesiveness and in that the overmoulding is carried out at the final dimensions of the housing. The invention also concerns a moulding apparatus and the housing obtained.

主权项

1. A method for producing an electronic housing of a chip card or telecommunication module type, comprising an electronic chip in the housing, a face comprising at least one set of conductive metallisations on the face, said method comprising the following steps:
provision or production of at least one set of metallisations comprising conductive circuit pads and/or tracks, on one side of a support; transfer and connection of a chip to each set of metallisations, overmoulding of each chip with its set of metallisations, on the support with a moulding material for producing at least one housing, separation of the housing from its support; wherein the side of the support in contact with the metallisations comprises an adhesive or has low adhesiveness, and wherein the overmoulding is carried out at the final dimension of the housing.