SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

Provided is a semiconductor device having satisfactory moisture resistance. By forming an area (25) having large irregularities on an upper side surface of a semiconductor chip (2) to be covered by an encapsulating resin (8), and an area (24) having small irregularities on a lower side surface of the semiconductor chip (2), adhesive strength between the semiconductor chip (2) and the encapsulating resin (8) is improved, and penetration of moisture from outside is prevented.

主权项

1. A semiconductor device, comprising:
a semiconductor chip; a die pad for supporting the semiconductor chip; an adhesive for adhering the semiconductor chip and the die pad; a plurality of signal leads extending toward a side of the die pad; bonding wires for connecting the semiconductor chip and the plurality of signal leads; and an encapsulating body for encapsulating with a mold resin, wherein a side surface of the semiconductor chip comprises a first irregular side surface and a second irregular side surface formed above the first irregular side surface, and wherein the second irregular side surface comprises second irregularities that are larger than first irregularities formed on the first irregular side surface.