发明名称 |
Plasma Method for Reducing Post-Lithography Line Width Roughness |
摘要 |
The present disclosure is related to a method for treating a photoresist structure on a substrate, the method comprising producing one or more resist structures on a substrate, introducing the substrate in a plasma reactor, and subjecting the substrate to a plasma treatment at a temperature lower than zero degrees Celsius, such as between zero and −110° C. The plasma treatment may be a H2 plasma treatment performed in an inductively coupled plasma reactor. The treatment time may be at least 30 s. |
申请公布号 |
US2015228497(A1) |
申请公布日期 |
2015.08.13 |
申请号 |
US201514616672 |
申请日期 |
2015.02.07 |
申请人 |
IMEC VZW ;Katholieke Universiteit Leuven, KU LEUVEN R&D |
发明人 |
De Schepper Peter;de Marneffe Jean-Francois;Altamirano Sanchez Efrain |
分类号 |
H01L21/308;H01L21/3065 |
主分类号 |
H01L21/308 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method for treating a photoresist structure on a substrate, the method comprising:
producing one or more resist structures on a substrate; introducing the substrate in a plasma reactor; subjecting the substrate to a plasma treatment at a temperature lower than zero degrees Celsius. |
地址 |
Leuven BE |