| 发明名称 |
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE |
| 摘要 |
A manufacturing method for a semiconductor device, including: loading a wafer into a reaction chamber; placing the wafer on a push-up shaft moved up; preheating the wafer under controlling an in-plane temperature distribution of the wafer to be a recess state under a state of placing the wafer on the push-up shaft moved up; lowering the push-up shaft with the wafer kept in the recess state to hold the wafer on a wafer holding member; heating the wafer to a predetermined temperature; rotating the wafer; and supplying a process gas onto the wafer. |
| 申请公布号 |
US2015228477(A1) |
申请公布日期 |
2015.08.13 |
| 申请号 |
US201514698031 |
申请日期 |
2015.04.28 |
| 申请人 |
NuFlare Technology, Inc. |
发明人 |
HIRATA Hironobu;YAJIMA Masayoshi;MORIYAMA Yoshikazu |
| 分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A manufacturing method for a semiconductor device, comprising:
loading a wafer into a reaction chamber; placing the wafer on a push-up shaft moved up; preheating the wafer under controlling an in-plane temperature distribution of the wafer to be a recess state under a state of placing the wafer on the push-up shaft moved up; lowering the push-up shaft with the wafer kept in the recess state to hold the wafer on a wafer holding member; heating the wafer to a predetermined temperature; rotating the wafer; and supplying a process gas onto the wafer. |
| 地址 |
Shizuoka-ken JP |
