发明名称 CONDUCTIVE SPONGE-FORMING SILICONE RUBBER COMPOSITION AND CONDUCTIVE SILICONE RUBBER SPONGE
摘要 A conductive sponge-forming liquid silicone rubber composition comprises: (A) an alkenyl group-containing polydiorganosiloxane; (B) a polyorganosiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (C) a conductive filler; (D) a mixture of water and an inorganic thickener; (E) an emulsifier; (F) a hydrosilylation reaction catalyst; and (G) a curing retarder. A conductive silicone sponge can be obtained by crosslinking and curing the conductive sponge-forming liquid silicone rubber. The conductive silicone rubber sponge generally has fine, uniform continuous porosity and electrical resistance with low voltage dependence.
申请公布号 US2015228372(A1) 申请公布日期 2015.08.13
申请号 US201314424452 申请日期 2013.09.04
申请人 DOW CORNING TORAY CO., LTD. 发明人 Akitomo Hiroshi;Irie Masakazu;Kurusu Hidetoshi
分类号 H01B1/24 主分类号 H01B1/24
代理机构 代理人
主权项 1. A conductive sponge-forming liquid silicone rubber composition comprising: (A) 100 parts by mass of an alkenyl group-containing polydiorganosiloxane composed of; (A1) from 0 to 90 parts by mass of a polydiorganosiloxane having both molecular terminals capped with alkenyl groups and not having any alkenyl groups in molecular side chains, and(A2) from 10 to 100 parts by mass of a polydiorganosiloxane having two or more alkenyl groups in molecular side chains; (B) a polyorganosiloxane having at least two silicon-bonded hydrogen atoms in a molecule, in an amount such that the number of moles of silicon-bonded hydrogen atoms in component (B) is from 0.4 to 20 per 1 mole of alkenyl groups in component (A); (C) from 1 to 100 parts by mass of a conductive filler; (D) from 10 to 250 parts by mass of a mixture comprising water and an inorganic thickener; (E) from 0.1 to 15 parts by mass of an emulsifier; (F) a hydrosilylation reaction catalyst, in an amount sufficient for crosslinking the composition; and (G) from 0.001 to 5 parts by mass of a curing retarder.
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