发明名称 |
METHOD FOR MANUFACTURING VERTICAL ELECTRONIC DEVICE, AND VERTICAL ELECTRONIC DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide: a method for manufacturing a vertical electronic device, capable of increasing an effective area (an area of an element formation region) of a substrate, and preventing the occurrence of abnormality such as chipping and cracking at an end part of a device structure; and a vertical electronic device. ! SOLUTION: A method for manufacturing a vertical electronic device includes: a step (S10) of preparing a substrate (an epitaxial substrate 13) that has a first main surface (13A) and a second main surface (13B) located on a side opposite to the first main surface (13A) and includes a plurality of vertical electronic devices formed thereon; a step (S20) of performing laser scribe processing on the substrate (13) from a side of the first main surface (13A); and a step (S30) of cleaving the substrate (13). ! COPYRIGHT: (C)2015,JPO&INPIT |
申请公布号 |
JP2015146406(A) |
申请公布日期 |
2015.08.13 |
申请号 |
JP20140019308 |
申请日期 |
2014.02.04 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
TAKAGI SHIMPEI ; UENO MASANORI |
分类号 |
H01L21/301;B23K26/00;B23K26/364;H01L21/20;H01L21/28;H01L21/304;H01L21/329;H01L29/47;H01L29/861;H01L29/868;H01L29/872 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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