发明名称 METHOD FOR MANUFACTURING VERTICAL ELECTRONIC DEVICE, AND VERTICAL ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide: a method for manufacturing a vertical electronic device, capable of increasing an effective area (an area of an element formation region) of a substrate, and preventing the occurrence of abnormality such as chipping and cracking at an end part of a device structure; and a vertical electronic device. ! SOLUTION: A method for manufacturing a vertical electronic device includes: a step (S10) of preparing a substrate (an epitaxial substrate 13) that has a first main surface (13A) and a second main surface (13B) located on a side opposite to the first main surface (13A) and includes a plurality of vertical electronic devices formed thereon; a step (S20) of performing laser scribe processing on the substrate (13) from a side of the first main surface (13A); and a step (S30) of cleaving the substrate (13). ! COPYRIGHT: (C)2015,JPO&INPIT
申请公布号 JP2015146406(A) 申请公布日期 2015.08.13
申请号 JP20140019308 申请日期 2014.02.04
申请人 SUMITOMO ELECTRIC IND LTD 发明人 TAKAGI SHIMPEI ; UENO MASANORI
分类号 H01L21/301;B23K26/00;B23K26/364;H01L21/20;H01L21/28;H01L21/304;H01L21/329;H01L29/47;H01L29/861;H01L29/868;H01L29/872 主分类号 H01L21/301
代理机构 代理人
主权项
地址