| 发明名称 |
SELF-ALIGNING CONDUCTIVE BUMP STRUCTURE AND METHOD OF FABRICATION |
| 摘要 |
A semiconductor device includes a substrate having a major surface and conductive bumps distributed over the major surface of the substrate. Each conductive bump of a first subset of the conductive bumps comprises a regular body and a second subset of the conductive bumps comprises a group of separate conductive bumps uniformly distributed around a periphery of a central opening. |
| 申请公布号 |
US2015228604(A1) |
申请公布日期 |
2015.08.13 |
| 申请号 |
US201514690581 |
申请日期 |
2015.04.20 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HUANG Cheng-Lin;CHEN I-Ting;SHIH Ying Ching;TSAI Po-Hao;LU Szu Wei;LIN Jing-Cheng;JENG Shin-Puu;YU Chen-Hua |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a substrate comprising a major surface; and conductive bumps distributed over the major surface of the substrate, wherein each conductive bump of a first subset of the conductive bumps comprises a regular body and a second subset of the conductive bumps comprises a group of separate conductive bumps uniformly distributed around a periphery of a central opening. |
| 地址 |
Hsinchu TW |
