发明名称 |
COPPER POST STRUCTURE FOR WAFER LEVEL CHIP SCALE PACKAGE |
摘要 |
In a method for forming a packaging structure, a metal pad is formed on a semiconductor substrate, and a first polymer insulating layer is formed over the semiconductor substrate. An opening passing through the first polymer insulating layer is formed to expose a portion of the metal pad. A copper-containing material is deposited in the opening and over the first polymer insulating layer, thereby forming a copper-containing layer having a first thickness and a first width over the first polymer insulating layer. A conductive bump having a second width is formed over the copper-containing layer, in which the second width is smaller than the first width. An exposed portion of the copper-containing layer is etched using the conductive bump as a mask until the exposed portion is reduced to a second thickness, thereby forming a monolithic copper-containing structure. |
申请公布号 |
US2015228597(A1) |
申请公布日期 |
2015.08.13 |
申请号 |
US201514690570 |
申请日期 |
2015.04.20 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
SHIH Chao-Wen;CHIANG Yung-Ping;HSIEH Chen-Chih;TSAI Hao-Yi |
分类号 |
H01L23/00;H01L21/56 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
1. A method, comprising:
depositing a copper-containing material over the semiconductor substrate, thereby forming a copper-containing layer having a first thickness and a first width over the semiconductor substrate; forming a conductive bump having a second width over the copper-containing layer, wherein the second width is smaller than the first width; and etching an exposed portion of the copper-containing layer using the conductive bump as a mask until the exposed portion is reduced to a second thickness, thereby forming a monolithic copper-containing structure comprising a top portion and a bottom portion adjoining the top portion, the top portion having a third thickness which is equal to the first thickness minus the second thickness, the bottom portion having the second thickness. |
地址 |
HSINCHU TW |