发明名称 |
SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD |
摘要 |
Disclosed is an apparatus and method for processing substrate, which is capable of realizing uniformity of a thin film deposited on a substrate, and facilitating quality control for the thin film, wherein the apparatus includes a process chamber, a chamber lid, a substrate supporter for supporting at least one of substrates, a source gas distributor for distributing source gas to a source gas distribution area, a reactant gas distributor for distributing reactant gas to a reactant gas distribution area, a purge gas distributor for distributing purge gas to a purge gas distribution area defined between the source gas distribution area and the reactant gas distribution area, wherein a distance between the purge gas distributor and the substrate is relatively smaller than a distance between the substrate and each of the source gas distributor and reactant gas distributor. |
申请公布号 |
US2015225848(A1) |
申请公布日期 |
2015.08.13 |
申请号 |
US201314422685 |
申请日期 |
2013.08.23 |
申请人 |
JUSUNG ENGINEERING CO. LTD. |
发明人 |
Han Jeung Hoon;Kim Young Hoon;Hwang Chul Joo |
分类号 |
C23C16/455;C23C16/50;C23C16/458 |
主分类号 |
C23C16/455 |
代理机构 |
|
代理人 |
|
主权项 |
1. A substrate processing apparatus comprising:
a process chamber for preparing a process space; a chamber lid for covering an upper side of the process chamber; a substrate supporter for supporting at least one of substrates, wherein the substrate supporter is provided in the process chamber, a source gas distributor for distributing source gas to a source gas distribution area defined on the substrate supporter, wherein the source gas distributor is provided in the chamber lid; a reactant gas distributor for distributing reactant gas to a reactant gas distribution area defined on the substrate supporter, wherein the reactant gas distributor is provided in the chamber lid; and a purge gas distributor for distributing purge gas to a purge gas distribution area defined between the source gas distribution area and the reactant gas distribution area, wherein the purge gas distributor is provided in the chamber lid, wherein a distance between the purge gas distributor and the substrate is relatively smaller than a distance between the substrate and each of the source gas distributor and reactant gas distributor. |
地址 |
Gwangiu-su, Gyeonggi-do KR |