发明名称 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD
摘要 Disclosed is an apparatus and method for processing substrate, which is capable of realizing uniformity of a thin film deposited on a substrate, and facilitating quality control for the thin film, wherein the apparatus includes a process chamber, a chamber lid, a substrate supporter for supporting at least one of substrates, a source gas distributor for distributing source gas to a source gas distribution area, a reactant gas distributor for distributing reactant gas to a reactant gas distribution area, a purge gas distributor for distributing purge gas to a purge gas distribution area defined between the source gas distribution area and the reactant gas distribution area, wherein a distance between the purge gas distributor and the substrate is relatively smaller than a distance between the substrate and each of the source gas distributor and reactant gas distributor.
申请公布号 US2015225848(A1) 申请公布日期 2015.08.13
申请号 US201314422685 申请日期 2013.08.23
申请人 JUSUNG ENGINEERING CO. LTD. 发明人 Han Jeung Hoon;Kim Young Hoon;Hwang Chul Joo
分类号 C23C16/455;C23C16/50;C23C16/458 主分类号 C23C16/455
代理机构 代理人
主权项 1. A substrate processing apparatus comprising: a process chamber for preparing a process space; a chamber lid for covering an upper side of the process chamber; a substrate supporter for supporting at least one of substrates, wherein the substrate supporter is provided in the process chamber, a source gas distributor for distributing source gas to a source gas distribution area defined on the substrate supporter, wherein the source gas distributor is provided in the chamber lid; a reactant gas distributor for distributing reactant gas to a reactant gas distribution area defined on the substrate supporter, wherein the reactant gas distributor is provided in the chamber lid; and a purge gas distributor for distributing purge gas to a purge gas distribution area defined between the source gas distribution area and the reactant gas distribution area, wherein the purge gas distributor is provided in the chamber lid, wherein a distance between the purge gas distributor and the substrate is relatively smaller than a distance between the substrate and each of the source gas distributor and reactant gas distributor.
地址 Gwangiu-su, Gyeonggi-do KR