发明名称 SINTER MOLD MATERIAL, SINTERING AND MOLDING METHOD, SINTER MOLD OBJECT, AND SINTERING AND MOLDING APPARATUS
摘要 A sintering and molding method includes forming a fluid mold material by heating a sinter mold material, which includes inorganic particles, a binder material and a binder material which bond together the inorganic particles, to a temperature equal to or more than the melting points of the binder materials, forming a mold layer by spreading the fluid mold material, layering a mold layer, applying UV ink to a desired region on the mold layer, forming a mold cross sectional pattern by curing the UV ink which is applied to a desired region on the mold layer, finishing a mold object by removing a region, where the UV ink is not applied, in the mold layer, carrying out heat treatment on the mold object at a temperature which is less than the initial temperature of thermal decomposition of the binder material, and carrying out sintering treatment on the mold object.
申请公布号 US2015224575(A1) 申请公布日期 2015.08.13
申请号 US201514601952 申请日期 2015.01.21
申请人 SEIKO EPSON CORPORATION 发明人 HIRATA Koki
分类号 B22F1/00;B22F3/105;C04B35/634;B22F3/00;B28B1/00;B28B11/24 主分类号 B22F1/00
代理机构 代理人
主权项 1. A sinter molding material, which is used a molding method which includes applying liquid droplets to a desired region of the sinter mold material and curing the liquid droplets, the sinter mold material comprising: first inorganic particles; a first thermoplastic binder which bonds together the first inorganic particles; and a second thermoplastic binder which bonds together the first inorganic particles, an initial temperature of thermal decomposition of the second thermoplastic binder being higher than an initial temperature of thermal decomposition of the first thermoplastic binder.
地址 Tokyo JP