HOUSING MOLDING TYPE CAPACITOR

摘要

The present invention relates to a capacitor molded inside a housing, which includes: capacitor devices (100) which are formed by winding a dielectric film and have a conductive thermal spraying plane at both sides; a housing case (200) comprising a device placement space (H) where the capacitor devices (100) are molded and arranged in plural columns as being laid down; and a first and a second busbar forming part (300) which are connected to the thermal spraying plane of the capacitor devices (100) electrically. The housing case (200) includes: a bottom plate (10) forming the device placement space (H) where the capacitor devices (200) are placed by forming a plurality of partition walls (15) which is protruded longitudinally; a long side wall plate (20) which faces the thermal spraying plane of the capacitor devices (200); and lateral wall plates (30, 40) for connecting both ends of the long side wall plate (20).