| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component built-in multilayer wiring board which can prevent reliability degradation in electrical connection between adjacent electrodes of a plurality of electronic components arranged together in an opening of a substrate. ! SOLUTION: An electronic component built-in multilayer wiring board comprises: a substrate 100 having at least one opening R10; a plurality of electronic components 200a and 200b, arranged in the opening R10, each of which has electrodes 210 and 220; an insulating layer 101 which is arranged on and around the electronic components 200a and 200b as well as on the substrate 100; a wiring layer 110 arranged on the insulating layer 101; and via conductors 311b and 312b which penetrates through the insulating layer 101 so as to electrically connect the electrodes 210 and 220 of the electronic components 200a and 200b to the wiring layer 101. In plan view, a portion 111 of the wiring layer is formed such that it is located within a range surr |
