| 发明名称 |
MASK FOR LOADING BALL, BALL LOADING APPARATUS AND METHOD FOR MANUFACTURING PRINTED WRING BOARD USING MASK |
| 摘要 |
A method for manufacturing a printed wiring board includes clamping a mask device at clamping portioned formed in the mask device with a movable clamp device to apply tensile force to the mask device, positioning the mask device over a printed wiring board having connection pads, applying the tensile force to the mask device through the clamping portions such that a mask of the mask device undergoes elastic deformation and positions of opening portions in the mask are vertically aligned relative to positions of the connection pads of the printed wiring board, and loading solder balls through the opening portions in the mask onto the connection pads of the printed wiring board, respectively. |
| 申请公布号 |
US2015230346(A1) |
申请公布日期 |
2015.08.13 |
| 申请号 |
US201514621828 |
申请日期 |
2015.02.13 |
| 申请人 |
IBIDEN CO., LTD. |
发明人 |
TANNO Katsuhiko;KAWAMURA Yusuke;ADACHI Seito |
| 分类号 |
H05K3/34;B32B38/10;H05K3/00;B32B37/24;B23K1/00;B23K3/06 |
主分类号 |
H05K3/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a printed wiring board, comprising:
clamping a mask device at a plurality of clamping portioned formed in the mask device with a movable clamp device configured to apply tensile force to the mask device; positioning the mask device over a printed wiring board having a plurality of connection pads; applying the tensile force to the mask device through the clamping portions such that a mask of the mask device undergoes elastic deformation and that positions of opening portions in the mask are vertically aligned relative to positions of the connection pads of the printed wiring board; and loading a plurality of solder balls through the plurality of opening portions in the mask onto the plurality of connection pads of the printed wiring board, respectively. |
| 地址 |
Ogaki JP |
