WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

摘要

The present technology relates to a wiring board and a method of manufacturing a wiring board which improve the accuracy of control related to an impedance and mitigate a transmission loss of a signal.;A wiring board includes: a plurality of insulation layers and a plurality of wiring layers which are laminated alternately; a component connection pad which is provided on one surface of the wiring board in a lamination direction of the insulation layers and the wiring layers, and to which an electronic component is connected; a circuit connection pad which is provided on another surface of the wiring board in the lamination direction and is connected to a circuit board; and a structure forming part which partly includes a coaxial structure, wherein each of the wiring layers is connected by a via, the coaxial structure includes an inner wiring part extending in the lamination direction and an outer wiring part located on a side corresponding to an outer peripheral surface of the inner wiring part through an insulating resin, and the inner wiring part is electrically connected to the component connection pad and the circuit connection pad.

主权项

1. A wiring board comprising:
a plurality of insulation layers and a plurality of wiring layers which are laminated alternately; a component connection pad which is provided on one surface of the wiring board in a lamination direction of the insulation layers and the wiring layers, and to which an electronic component is connected; a circuit connection pad which is provided on another surface of the wiring board in the lamination direction and is connected to a circuit board; and a structure forming part which partly includes a coaxial structure, wherein each of the wiring layers is connected by a via, the coaxial structure includes an inner wiring part extending in the lamination direction and an outer wiring part located on a side corresponding to an outer peripheral surface of the inner wiring part through an insulating resin, and the inner wiring part is electrically connected to the component connection pad and the circuit connection pad.