| 发明名称 |
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS |
| 摘要 |
A manufacturing a semiconductor device of the present disclosure includes coating a photosensitive material on a workpiece; exposing the photosensitive material using a first exposure mask; performing a positive-tone development on the photosensitive material using a first developer after the first exposing; exposing the photosensitive material using a second exposure mask after the first developing; and performing a negative-tone development on the photosensitive material using a second developer after the second exposing. |
| 申请公布号 |
US2015227047(A1) |
申请公布日期 |
2015.08.13 |
| 申请号 |
US201514619554 |
申请日期 |
2015.02.11 |
| 申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
YAEGASHI Hidetami |
| 分类号 |
G03F7/20;H01L21/027;G03F7/16;H01L21/67 |
主分类号 |
G03F7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a semiconductor device, comprising:
coating a photosensitive material on a workpiece; exposing the photosensitive material using a first exposure mask; performing a positive-tone development on the photosensitive material using a first developer after the first exposing; exposing the photosensitive material using a second exposure mask after the first developing; and performing a negative-tone development on the photosensitive material using a second developer after the second exposing. |
| 地址 |
Tokyo JP |
