| 摘要 |
A method for producing an optoelectronic arrangement is specified, having the following steps of: - providing a connection carrier (1) having a contact area (12) and two connection points (13) which are connected to the contact area (12) in an electrically conductive manner, - providing an optoelectronic component (2) having a connection area (22), - applying an electrically conductive connecting material (3) to the contact area (12) of the connection carrier (1), and - heating the contact area (12) of the connection carrier (1) by energizing the contact area (12) via the two connection points (13), wherein the electrically conductive connecting material (3) is heated by the contact area (12) in such a manner that the connecting material (3) melts or hardens. |
