| 摘要 |
PROBLEM TO BE SOLVED: To stably manufacture a pseudo-adhesive label even when processing conditions such as a sticking temperature and the like are changed.SOLUTION: A hot-melt adhesive composition of the present invention is used for pseudo-adhesion and contains a thermoplastic resin containing an ethylene-propylene copolymer, and a solid paraffin. The solid paraffin is contained in an amount of 1-20 pts.mass based on 100 pts.mass of the thermoplastic resin. The melt viscosity of the hot-melt adhesive composition is 2,000-10,000 mPa s at 160°C. |
