| 发明名称 |
POLYIMIDE RESIN COMPOSITION |
| 摘要 |
Provided is a polyimide resin composition capable of forming a polyimide film which is excellent in transparency and heat resistance and has a low thermal linear expansion coefficient. The polyimide resin composition contains a polyimide resin produced by reacting (A) a tetracarboxylic dianhydride with (B) a diamine containing a phenolic hydroxyl group-containing diamine in an amount of from 5 to 100 mol % of the total diamine; and silica microparticles, in a ratio by mass of from 25/75 to 60/40. |
| 申请公布号 |
US2015225523(A1) |
申请公布日期 |
2015.08.13 |
| 申请号 |
US201314430341 |
申请日期 |
2013.09.27 |
| 申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
Suenaga Shuya;Matsumaru Teruhisa |
| 分类号 |
C08J5/18;B32B17/06;B32B27/06;C08K3/36;B32B15/088 |
主分类号 |
C08J5/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A polyimide resin composition comprising:
a polyimide resin produced by reacting (A) a tetracarboxylic dianhydride with (B) a diamine containing a phenolic hydroxyl group-containing diamine in an amount of from 5 to 100 mol % of the total diamine; and silica microparticles,in a ratio by mass of from 25/75 to 60/40. |
| 地址 |
Tokyo JP |
