| 发明名称 |
EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
There is provided an embedded board and a method of manufacturing the same. According to an exemplary embodiment of the present disclosure, an embedded board includes: an insulating layer made of a photosensitive material; a first circuit pattern formed inside the insulating layer and formed to make a lower surface be exposed from a lower surface of the insulating layer; an electronic device disposed on the first circuit pattern; a second circuit pattern formed on the insulating layer; and a first via formed inside the insulating layer and having an upper surface connected to the second circuit pattern and formed to make a lower surface be exposed from the lower surface of the insulating layer. |
| 申请公布号 |
US2015230340(A1) |
申请公布日期 |
2015.08.13 |
| 申请号 |
US201414488212 |
申请日期 |
2014.09.16 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE Young Mi;Lee Jae Soo |
| 分类号 |
H05K1/18;H05K1/02;H05K3/42;H05K1/11;H05K3/46;H05K3/30 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An embedded board, comprising:
an insulating layer made of a photosensitive material; a first circuit pattern formed inside the insulating layer and formed to make a lower surface be exposed from a lower surface of the insulating layer; an electronic device disposed on the first circuit pattern; a second circuit pattern formed on the insulating layer; and a first via formed inside the insulating layer and having an upper surface connected to the second circuit pattern and formed to make a lower surface be exposed from the lower surface of the insulating layer. |
| 地址 |
Suwon-Si KR |
