发明名称 LASER MACHINING DEVICE
摘要 A laser machining device has a laser oscillation device (2), an acoustic optical element (3), a first measuring instrument (6), a machining section (5), and a control unit (7). The laser oscillation device (2) outputs an output beam (B0). The acoustic optical element (3), which is irradiated by the output beam (B0), selectively emits the output beam (B0) in either a first optical path (R1) or a second optical path (R2). The first measuring instrument (6), which is provided in the first optical path (R1), measures the energy of a machining beam (B2). The machining section (5) is provided in the second optical path (R2). The control unit (7) controls the laser oscillation device (2) and the acoustic optical element (3), and receives a first measured value measured by the first measuring instrument (6). The output beam (B0) emitted in the first optical path (R1) is radiated from the acoustic optical element (3) directly onto the first measuring instrument (6). The control unit (7) detects abnormalities in the machining beam (B2) on the basis of the first measured value.
申请公布号 WO2015118829(A1) 申请公布日期 2015.08.13
申请号 WO2015JP00311 申请日期 2015.01.26
申请人 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. 发明人 HIRAMOTO, TADAHIRO;UCHIKATA, AKIMASA;NISHIHARA, MANABU;MURAKOSHI, TOSHIICHI;SASAKI, YOSHINORI;FUNAI, KOHEI
分类号 B23K26/00;B23K26/064;B23K26/067;H01S3/00 主分类号 B23K26/00
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