| 摘要 |
<p>In the present invention, with respect to a wafer map data image, in an array image of dies that is the same as a wafer image captured by a camera, the compartment of each die partitioned by lattice-shaped lines is displayed at the same size as each die of the wafer image. A worker operates a touch panel or an input device such as a mouse or keyboard, moves the display position of the wafer image or the wafer map data image over the screen of a display device, and causes the overlapping and alignment of the wafer image and the wafer map data image, thereby collating the wafer image and the wafer map data image, and designating a suction start die. Thereafter, production is started, and in accordance with wafer map data, only favorable dies are picked up sequentially from the suction start die, and are mounted to a substrate.</p> |
