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发明名称
半導体装置およびその製造方法
摘要
申请公布号
JP5763696(B2)
申请公布日期
2015.08.12
申请号
JP20130042131
申请日期
2013.03.04
申请人
发明人
分类号
H01L25/065;H01L25/07;H01L25/18
主分类号
H01L25/065
代理机构
代理人
主权项
地址
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