| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor chip that can secures a sufficient yield of manufacture by suppressing warpage of a semiconductor wafer in a thinning process, and to provide a film for processing. <P>SOLUTION: In the method of manufacturing the semiconductor chip, the film 1 for processing which has a width larger than the diameter of the semiconductor wafer 10 and whose base film 2 has a thickness of 50 to 120μm is stuck on a circuit surface 10a of the semiconductor wafer 10. Consequently, when an excess portion 12 of the film 1 for processing which protrudes from the circuit surface 10a of the semiconductor wafer 10 is removed, operation efficiency is held excellent, and formation of burrs of a cut portion of the film 1 for processing and cutting wastes is suppressed. Further, the semiconductor wafer 10 is made thin in a state where warpage thereof is suppressed, so the semiconductor wafer 10 can be flattened without being broken and a dicing tape 16 can be stuck, thereby securing the yield of the manufacture. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
