| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a carry-out/in device in which a plurality of wafers are transported automatically and processed continuously with simple configuration while decreasing the number of components, at a low manufacturing cost. <P>SOLUTION: In the unit carry-out/in device, a workpiece unit is carried in or out for a holding means by moving the frame holding portion of a carry-out/in means vertically when the unit passage part of a turntable and the holding means are located directly under the frame holding portion of the carry-out/int means. A workpiece unit is carried out or in for a unit support part by moving the frame holding portion of a carry-out/in means vertically, when the unit support part of a turntable is located directly under the frame holding portion of the carry-out/in means. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
