发明名称 基板とクランプ準備ユニットをクランプする方法
摘要 The invention relates to a method of clamping a substrate on a surface of a substrate support structure. First, a liquid is applied on a surface of the substrate support structure. The surface is provided with a plurality of contact elements. The liquid is applied such that the contact elements are fully covered by a liquid layer. Then the substrate is provided and placed onto the liquid layer. Finally, liquid underneath the substrate is removed such that the substrate rests on the plurality of contact elements and is clamped by means of a capillary clamping force exerted by a capillary layer of the liquid between the substrate and the surface of the substrate support structure.
申请公布号 JP5762982(B2) 申请公布日期 2015.08.12
申请号 JP20110550569 申请日期 2010.02.18
申请人 マッパー・リソグラフィー・アイピー・ビー.ブイ. 发明人 デ・ヨング、ヘンドリク・ヤン;ウィーランド、マルコ・ヤン−ヤコ
分类号 H01L21/027;G03F7/20;H01L21/683 主分类号 H01L21/027
代理机构 代理人
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