| 摘要 |
The invention relates to an arrangement and a method for cooling a support (203) having an electronic component, comprising a housing (200) with a base plate (204), a circumferential wall (220) surrounding the support and a cover (211) extending above the support and closing the interior space (230) of the support. The aim is to cool the support directly by a cooling fluid that flows through the base plate without having the risk of damage to the support. In order to achieve said aim, it is proposed that the interior space (230) is subjected to a pressure that is greater than the pressure which is generated by the cooling fluid and is acting upon the support (202). |
