发明名称 DIE CLEANING METHOD
摘要 <p>There is disclosed a die cleaning method for removing a forming-material from a die used in forming the forming-material containing a binder, comprising the steps of: removing a part or all of the binder contained in the forming-material from the die; and removing the forming-material from the die, whereby the forming-material in the die can be removed without damaging or deforming the die for use in forming the forming-material containing the binder. <IMAGE></p>
申请公布号 EP1502665(B1) 申请公布日期 2015.08.12
申请号 EP20030745399 申请日期 2003.01.31
申请人 NGK INSULATORS, LTD. 发明人 WADA, YUKIHISA;KANEKO, TAKAHISA;NATE, MASAYUKI
分类号 B08B5/02;B08B7/04;B08B3/02;B08B7/00;B08B9/00;B28B3/20;B28B7/38;B29C47/08;B29C47/12;B29C47/20;B29K103/00 主分类号 B08B5/02
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