发明名称 |
DIE CLEANING METHOD |
摘要 |
<p>There is disclosed a die cleaning method for removing a forming-material from a die used in forming the forming-material containing a binder, comprising the steps of: removing a part or all of the binder contained in the forming-material from the die; and removing the forming-material from the die, whereby the forming-material in the die can be removed without damaging or deforming the die for use in forming the forming-material containing the binder. <IMAGE></p> |
申请公布号 |
EP1502665(B1) |
申请公布日期 |
2015.08.12 |
申请号 |
EP20030745399 |
申请日期 |
2003.01.31 |
申请人 |
NGK INSULATORS, LTD. |
发明人 |
WADA, YUKIHISA;KANEKO, TAKAHISA;NATE, MASAYUKI |
分类号 |
B08B5/02;B08B7/04;B08B3/02;B08B7/00;B08B9/00;B28B3/20;B28B7/38;B29C47/08;B29C47/12;B29C47/20;B29K103/00 |
主分类号 |
B08B5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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