| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a component installing method and a component installing structure, having a simple manufacturing process, and capable of suppressing the breakage of a chip component even if a substrate is bent and deformed by external force. <P>SOLUTION: In a component installing method, a solder layer 5 is provided on an electrode land 4 provided on an upper surface of a substrate 1, and while the solder layer 5 is melted to electrically connect a connection electrode 3 of a chip component 2 and the electrode land 4, the chip component 2 is installed to the substrate 1. When the solder layer 5 is melted, surface tension of the solder layer 5 is made to partially differ. Therefore, the chip component 2 can be tilted and installed so as to rise on the substrate 1 by the surface tension which partially differs of the melted solder layer 5. Consequently, bending strength of the chip component 2 can be improved, and when the substrate 1 is bent and deformed by external force, stress generated in the connection electrode 3 of the chip component 2 is diffused to suppress the generation of cracks in the inside of the chip component 2. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
