| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent resolution and tent reliability, and a photosensitive element, a method for producing a resist pattern, and a method for producing a printed wiring board using the photosensitive resin composition.SOLUTION: A photosensitive resin composition comprises a binder polymer (component A), a polymerizable monomer which has at least one ethylenically unsaturated bond (component B), and a photopolymerization initiator (component C). The component B comprises a reaction product of a triisocyanate compound having an isocyanurate ring and an acrylate compound having a hydroxy group, where the content of a compound having an isocyanurate ring and a urethane bond included in the reaction product is 15 mass% or more. |
