| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve an aptitude of automatic packaging by an automatic packaging machine with respect to a dust-free packaging bag for packaging an electronic material component etc., which is requested to have high-level cleanness. <P>SOLUTION: There is provided the dust-free packaging bag for electronic component etc., which has a sealant layer 2 at least as an innermost layer. In the packaging bag, an antistatic layer of a polythiophene-based conductive polymer is formed on the reverse surface (surface stuck on an adjacent layer) of a film of an outermost layer 4, and a peak value of an initial triboelectric charge voltage is 2.0 kV in terms of an absolute value in a triboelectric charge voltage test of a surface of the outermost layer film. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
