MULTI CLIP MOUNTING METHOD FOR SEMICONDUCTOR PACKAGES AND MULTI CLIP MOUNTING SYSTEM

摘要

Provided are a method for attaching a clip of a semiconductor package and a multi-clip attaching device used therein. The method includes the steps of: preparing a lead frame in which semiconductor chips are mounted in a first arrangement; preparing a clip frame which has a pitch smaller than the pitch of the first arrangement and in which multiple clips are connected in a second arrangement; cutting connection portions between the clip to separate the clips from the clip frame; putting the separated clips on upper face pad portions of the pad blocks of a pitch extension stage including linear motor driving units connected to the pad blocks; adjusting the distances among the pad blocks such that the second arrangement of the clips has the same pitch as the first arrangement of the semiconductor chips; and attaching the clips are simultaneously onto the semiconductor chips, respectively.