发明名称 Method for forming metal oxide film, metal oxide film, and apparatus for forming metal oxide film
摘要 The present invention aims at providing a method for forming a metal oxide film which can further improve the production efficiency while maintaining low resistance of a metal oxide film formed thereby. In the method for forming a metal oxide film of the present invention, a solution (4) containing a metallic element and ammonia (4a) is formed into a mist. Meanwhile, a substrate (2) is heated. Then, the solution (4) formed into a mist is supplied onto a first main surface of the substrate (2) being heated.
申请公布号 US9103028(B2) 申请公布日期 2015.08.11
申请号 US200913265193 申请日期 2009.04.20
申请人 TOSHIBA MITSUBISHI—ELECTRIC INDUSTRIAL SYSTEMS CORPORATION;KYOTO UNIVERSITY 发明人 Orita Hiroyuki;Shirahata Takahiro;Yoshida Akio;Fujita Shizuo;Kameyama Naoki
分类号 C23C16/40;C23C16/448 主分类号 C23C16/40
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A method for forming a metal oxide film, the method comprising: (A) forming a solution comprising a metallic element and ammonia into a mist; (B) heating a substrate, wherein the heating temperature is maintained at 300° C. or less; and (C) supplying the mist from (A) onto a first main surface of the substrate from (B) to form a metal oxide film, wherein the metal oxide film is a n-type semiconductor.
地址 Tokyo JP