发明名称 |
Method for forming metal oxide film, metal oxide film, and apparatus for forming metal oxide film |
摘要 |
The present invention aims at providing a method for forming a metal oxide film which can further improve the production efficiency while maintaining low resistance of a metal oxide film formed thereby. In the method for forming a metal oxide film of the present invention, a solution (4) containing a metallic element and ammonia (4a) is formed into a mist. Meanwhile, a substrate (2) is heated. Then, the solution (4) formed into a mist is supplied onto a first main surface of the substrate (2) being heated. |
申请公布号 |
US9103028(B2) |
申请公布日期 |
2015.08.11 |
申请号 |
US200913265193 |
申请日期 |
2009.04.20 |
申请人 |
TOSHIBA MITSUBISHI—ELECTRIC INDUSTRIAL SYSTEMS CORPORATION;KYOTO UNIVERSITY |
发明人 |
Orita Hiroyuki;Shirahata Takahiro;Yoshida Akio;Fujita Shizuo;Kameyama Naoki |
分类号 |
C23C16/40;C23C16/448 |
主分类号 |
C23C16/40 |
代理机构 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. A method for forming a metal oxide film, the method comprising:
(A) forming a solution comprising a metallic element and ammonia into a mist; (B) heating a substrate, wherein the heating temperature is maintained at 300° C. or less; and (C) supplying the mist from (A) onto a first main surface of the substrate from (B) to form a metal oxide film, wherein the metal oxide film is a n-type semiconductor. |
地址 |
Tokyo JP |