| 发明名称 | Semiconductor apparatus | ||
| 摘要 | According to one embodiment, a semiconductor apparatus includes a substrate, a first semiconductor chip, a second semiconductor chip and a first converter. The first semiconductor chip includes a first surface and a second surface and is mounted on the substrate, the first surface is opposed to the substrate, the second surface is opposed to the first surface. The second semiconductor chip includes a first area and is stacked on the second surface. The first converter is arranged in the first area, the first converter is configured to perform at least one of analog-to-digital conversion and digital-to-analog conversion and arranged in the first area. A part of the first area does not overlap the first semiconductor chip when viewed from a direction perpendicular to the second surface. | ||
| 申请公布号 | US9105462(B2) | 申请公布日期 | 2015.08.11 |
| 申请号 | US201314092509 | 申请日期 | 2013.11.27 |
| 申请人 | KABUSHIKI KAISHA TOSHIBA | 发明人 | Tsutsumi Yukako;Okuni Hidenori;Akita Koji |
| 分类号 | H01L25/00 | 主分类号 | H01L25/00 |
| 代理机构 | Holtz, Holtz, Goodman & Chick PC | 代理人 | Holtz, Holtz, Goodman & Chick PC |
| 主权项 | 1. A semiconductor apparatus, comprising: a substrate; a first semiconductor chip including a first surface and a second surface and being mounted on the substrate, the first surface being opposed to the substrate, the second surface being opposed to the first surface; a second semiconductor chip including a first area and being stacked on the second surface; and a first converter arranged in the first area, the first converter configured to perform at least one of analog-to-digital conversion and digital-to-analog conversion, wherein a part of the first area does not overlap the first semiconductor chip when viewed from a direction perpendicular to the second surface. | ||
| 地址 | Tokyo JP | ||