Methods and arrangements relating to semiconductor packages including multi-memory dies

摘要

Embodiments provide a method comprising providing a multi-memory die that comprises multiple individual memory dies. Each of the individual memory dies is defined as an individual memory die within a wafer of semiconductor material during production of memory dies. The multi-memory die is created by singulating the wafer of semiconductor material into memory dies where at least one of the memory dies is a multi-memory die that includes multiple individual memory dies that are still physically connected together. The method further comprises coupling a semiconductor die to the multi-memory die.

主权项

1. A method comprising:
providing a multi-memory die that comprises multiple individual memory dies, wherein
each of the individual memory dies is defined as an individual memory die within a wafer of semiconductor material during production of memory dies, andthe multi-memory die is created by singulating the wafer of semiconductor material into memory dies where at least one of the memory dies is a multi-memory die that includes at least a first memory die and a second memory die that are physically connected together along a border region; and coupling a semiconductor die to the multi-memory die, wherein the semiconductor die is mounted on at least a part of the border region of the multi-memory die.