发明名称 |
LED module and method for manufacturing the same |
摘要 |
An LED module includes an LED unit having an LED chip, a lens covering the LED chip, and a diffusing film. The lens includes a light-incident face facing the LED chip, a light-emitting face opposite to the light-incident face, and a connecting face connecting the light-incident face to the light-emitting face. The diffusing film has a plurality of macromolecule diffusing particles mixed therein, and is coated on the light-emitting face of the lens. |
申请公布号 |
US9103525(B2) |
申请公布日期 |
2015.08.11 |
申请号 |
US201313870146 |
申请日期 |
2013.04.25 |
申请人 |
HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
Huang Yung-Lun |
分类号 |
F21V5/04;G02B5/02;F21V5/08;G02B19/00;F21Y101/02 |
主分类号 |
F21V5/04 |
代理机构 |
Novak Druce Connolly Bove + Quigg LLP |
代理人 |
Novak Druce Connolly Bove + Quigg LLP |
主权项 |
1. A light emitting diode (LED) module comprising:
an LED unit comprising an LED chip; a lens covering the LED chip, the lens comprising a light-incident face facing the LED chip, a light-emitting face opposite to the light-incident face, and a connecting face connecting the light-incident face to the light-emitting face; and a diffusing film coated on the light-emitting face of the lens, the diffusing film comprising a plurality of macromolecule diffusing particles mixed therein, wherein a thickness of the diffusing film gradually decreases from a center to a periphery of the light-emitting face, and wherein an entirety of the diffusing film is manufactured from a same material. |
地址 |
New Taipei TW |