Assembly with condition monitoring and a method for condition monitoring

摘要

An assembly that is provided with condition monitoring includes a first element having two or more electrically conductive contact members (102-105), a second (106) element attached to the two or more electrically conductive contact members and providing galvanic connections between the contact members. The assembly further includes a monitoring circuit (120) for monitoring electrical conductivities of the galvanic connections and for generating an indicator signal in response to a situation in which the electrical conductivity of one or more of the galvanic connections is lower than a threshold. When the joint between the first and second elements is totally or partially out of order, the electrical conductivity of one or more of the galvanic connections is low or zero and thus the indicator signal is generated. Therefore, the condition of the joint can be electrically monitored.

主权项

1. An assembly comprising:
a first element provided with two or more electrically conductive contact members; a second element attached to the two or more electrically conductive contact members; an electronic component; and a cooling element,wherein
the second element comprises electrically conductive material providing one or more galvanic connections between the two or more electrically conductive contact members, the first element is a circuit board, the two or more electrically conductive contact members are connection pads on a surface of the circuit board, and the second element is soldered to the connection pads, the assembly further comprises a monitoring circuit for monitoring electrical conductivities of the one or more galvanic connections and for generating an indicator signal in response to a situation in which the electrical conductivity of the one or more of the galvanic connections is lower than a threshold, and the second element constitutes a part of a mechanical structure arranged to press the cooling element against the electronic component and at least part of force due to the pressing of the cooling element against the electronic component is received by the soldering between the connection pads and the second element.