发明名称 |
Heat dissipating module and computer using same |
摘要 |
A heat dissipating module includes a heat sink and an aerofoil deflector above the heat sink. The heat sink has an upper surface corresponding to the camber of the deflector, to increase the speed and efficiency of a cooling airflow passing therethrough, the airflow generated by a fan. |
申请公布号 |
US9104388(B2) |
申请公布日期 |
2015.08.11 |
申请号 |
US201313855877 |
申请日期 |
2013.04.03 |
申请人 |
HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
Yang Feng-Chi |
分类号 |
G06F1/20;F28D1/02;H01L23/467;H01L23/367;H01L23/427;F28D15/02 |
主分类号 |
G06F1/20 |
代理机构 |
Novak Druce Connolly Bove + Quigg LLP |
代理人 |
Novak Druce Connolly Bove + Quigg LLP |
主权项 |
1. A heat dissipating module, comprising:
a heat sink, including an upper surface; and an aerofoil deflector, mounted over the upper surface of the heat sink, the deflector including an aerofoil bottom surface spaced and facing the upper surface of the heat sink; wherein the upper surface of the heat sink is in the shape of a V, along a direction of the airflow flowing therethrough, the heat sink further includes a valley defined on the upper surface, the valley divides the upper surface into two inclined sub-surfaces; wherein the deflector includes a camber defined on the bottom surface, the camber is disposed over the valley. |
地址 |
New Taipei TW |