Ceramic substrate and method of manufacturing the same

摘要

A ceramic substrate includes: a substrate body formed by laminating a plurality of ceramic layers and including a first and second opposing principal surfaces and a peripheral portion having a positioning portion; a first conductor pad formed on the first principal surface; a second conductor pad formed on the second principal surface and having a diameter smaller than that of the first conductor pad. The positioning portion includes first and second through holes that individually pass through respective ceramic layers and are connected to each other in an axial direction. The first through hole passes through the first principal surface. The second through hole passes through the second principal surface and has a cross-sectional area that is smaller than that of the first through hole. At least apart of a peripheral edge of a ceramic layer defining the second through hole is visible through the first through hole.

主权项

1. A ceramic substrate comprising:
a substrate body formed by laminating a plurality of ceramic layers and including a first principal surface, a second principal surface on an opposing side of the substrate body from the first principal surface, and a peripheral portion around a periphery of the substrate body in plan view, the peripheral portion having a plurality of positioning portions; a first conductor pad formed on the first principal surface; a second conductor pad formed on the second principal surface and having a diameter or a shortest length in plan view smaller than that of the first conductor pad; and a conductor post connected to at least one of the first conductor pad and the second conductor pad and formed in the substrate body; wherein at least one of the plurality of positioning portions defines a continuous hole including a first through hole and a second through hole that are each defined by respective ceramic layers, have different cross-sectional areas, and are in communication with each other in an axial direction, wherein the first through hole passes through the first principal surface, wherein the second through hole passes through the second principal surface and has a transverse cross-sectional area that is smaller than a transverse cross-sectional area of the first through hole, and at least a part of an inner peripheral surface of a ceramic layer defining the second through hole is visible through the first through hole.