| 发明名称 | Multilayer printed circuit board and device comprising the same | ||
| 摘要 | A multilayer printed circuit board may comprise at least one printed circuit board front end that is thermally conductively metalized. An apparatus with such a printed circuit board is also proposed. | ||
| 申请公布号 | US9107295(B2) | 申请公布日期 | 2015.08.11 |
| 申请号 | US201213709964 | 申请日期 | 2012.12.10 |
| 申请人 | ZF Friedrichshafen AG | 发明人 | Lassmann Wilfried;Büttner Christian |
| 分类号 | H05K5/00;H05K1/02;H05K3/00 | 主分类号 | H05K5/00 |
| 代理机构 | Brinks Gilson & Lione | 代理人 | Brinks Gilson & Lione |
| 主权项 | 1. An apparatus, comprising: a multilayer printed circuit board comprising a plurality of printed circuit board layers; a front end, being a thermal conductive layer, connecting a lateral surface of the multilayer printed circuit board for heat transfer; and at least one edge via in the printed circuit board being thermally conductively contacted to the front end, wherein at least one heat conducting channel is formed extending from a heat source on the multilayer printed circuit board to the front end through the at least one edge via. | ||
| 地址 | Friedrichshafen DE | ||