发明名称 3D non-volatile memory device, memory system including the same, and method of manufacturing the same
摘要 A three-dimensional 3D nonvolatile memory device includes vertical channel layers protruding from a substrate; interlayer insulating layers and conductive layer patterns alternately deposited along the vertical channel layers; a barrier metal pattern surrounding each of the conductive layer patterns; a charge blocking layer interposed between the vertical channel layers and the barrier metal patterns; and a diffusion barrier layer interposed between the barrier metal patterns and the charge blocking layer.
申请公布号 US9105515(B2) 申请公布日期 2015.08.11
申请号 US201414559594 申请日期 2014.12.03
申请人 SK Hynix Inc. 发明人 Kim Suk Goo
分类号 H01L21/4763;H01L27/115;H01L29/66;H01L29/792;H01L21/28;H01L21/3213;H01L21/768 主分类号 H01L21/4763
代理机构 IP & T GROUP LLP 代理人 IP & T GROUP LLP
主权项 1. A method of manufacturing a 3D non-volatile memory device, comprising: alternately depositing first material layers and second material layers on a substrate; forming vertical channel layers passing through the first material layers and the second material layers; forming a slit between the vertical channel layers by etching the first material layers and the second material layers; forming trenches by removing the second material layers exposed through the slit; sequentially forming a charge blocking layer, a diffusion barrier layer, and a barrier metal layer along a surface of the slit and along surfaces of the trenches; forming a conductive layer filling the trenches on the barrier metal layer; and etching the conductive layer, the barrier metal layer, and the diffusion barrier layer from the surface of the slit between each of the trenches, so that the conductive layer, the barrier metal layer, and the diffusion barrier layer formed in one of the trenches is separated from the conductive layer, the barrier metal layer, and the diffusion barrier layer formed in another one of the trenches.
地址 Gyeonggi-do KR