| 发明名称 | Integrated circuit including an environmental sensor | ||
| 摘要 | An integrated circuit and a method of making the same. The integrated circuit includes a semiconductor substrate including at least one environmental sensor. The integrated circuit also includes a cap layer located on a major surface of the substrate. The integrated circuit further includes at least one elongate channel for allowing access of said sensor to an environment surrounding the integrated circuit. | ||
| 申请公布号 | US9105479(B2) | 申请公布日期 | 2015.08.11 |
| 申请号 | US201314018484 | 申请日期 | 2013.09.05 |
| 申请人 | ams International AG | 发明人 | Besling Willem Frederik Adrianus;Kengen Martien |
| 分类号 | H01L23/04;B81B7/00;H01L23/31;H01L21/50;H01L21/77 | 主分类号 | H01L23/04 |
| 代理机构 | McDermott Will & Emery LLP | 代理人 | McDermott Will & Emery LLP |
| 主权项 | 1. An integrated circuit comprising: a semiconductor substrate including at least one environmental sensor; a cap layer located on a major surface of the substrate, and at least one elongate channel for allowing access of said sensor to an environment surrounding the integrated circuit; wherein the cap layer comprises: portions that are substantially transparent to allow light to reach an ambient light sensor located in the substrate; and portions that are substantially opaque to prevent light reaching a temperature sensor located in the substrate. | ||
| 地址 | Rapperswil-Jona CH | ||