Optical semiconductor element package and optical semiconductor device

摘要

An optical semiconductor element package, includes a ceramic wiring substrate portion having a mounting area for mounting an optical semiconductor element in a center part, and including an element electrode for connecting the optical semiconductor element, and an external connection electrode connected to the element electrode, and a metal sealing ring provided on the ceramic wiring substrate portion, and including an opening portion exposing the element electrode and the mounting area, in a center part, and a ring-like protruding portion provided to an outer peripheral part of the opening portion.

主权项

1. An optical semiconductor element package, comprising:
a ceramic wiring substrate having a mounting area for mounting an optical semiconductor element, in a center part; an element electrode for connecting the optical semiconductor element, the element electrode provided on the ceramic wiring substrate; an external connection electrode electrically connected to the element electrode, the external connection electrode provided to the ceramic wiring substrate; an upper ground plane provided on an upper face of the ceramic wiring substrate; first opening portions formed in the upper ground plane, the first opening portions being at least a first groove and a second groove each shaped like a substantially continuous half-circle and opposed to each other, in a planar view, wherein the grooves prevent brazing material from flowing into an inner area of the ceramic wiring substrate; a lower ground plane provided on a lower face of the ceramic wiring substrate; and a metal sealing ring provided on the ceramic wiring substrate, and including a second opening portion exposing the element electrode and the mounting area, in a center part, and a ring-like protruding portion provided to an outer peripheral part of the second opening portion, wherein an outer shape of the metal sealing ring is larger than an outer shape of the ceramic wiring substrate, wherein an outer shape of the ceramic wiring substrate has a hexagonal shape or an octagonal shape.